| 摘要 |
PURPOSE: A template for forming solder bump and method for manufacturing the same are provided to reduce the manufacturing cost and to achieve heat resistance against the post process such as a reflow process. CONSTITUTION: The template for forming solder bump includes a plurality of accommodating groove(110) for accommodating the solder ball and the template(100). The method for manufacturing the template comprises the mold frame manufacturing step, the resin infusion step, the resin stiffening step, and the resin isolation step. The mold frame manufacturing step makes the mold frame has a plurality of protrusion. The resin infusion step pours the heat-resistant resin of liquid into one side of the mold frame. The resin stiffening step hardens the heat-resistant resin. The resin isolation step separates the hardened heat-resistant resin from the mold frame.
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