Adhesive compositons, adhesive films, dicing die bonding films, semiconductor wafers and semiconductor devices comprising the same

摘要

PURPOSE: An adhesive composition is provided to suppress the generation of burr during dicing process. CONSTITUTION: An adhesive composition satisfies general formula 1, T= 50 gf-150 gf. T means tack force of adhesive layer at 130°C. An adhesive film contains base film and adhesive layer. The adhesive layer is formed on the base film. A dicing die-bonding film comprises the base film and adhesive part. The adhesive part is formed on the base film.