| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor package substrate capable of preventing cracks from occurring in a conductor layer by reducing stress applied to a bend at a bump electrode section. <P>SOLUTION: The semiconductor package substrate 10 includes an insulating resin layer 2, and a circuit conductor layer 4 that is formed on a first surface 2a in the insulating resin layer 2, and includes the bump electrode section 5 that is exposed from a second surface 2b opposite to the first one 2a of the insulating resin layer 2 for joining to an external terminal. The inside of the bump electrode section 5 is filled with the same resin composition as a resin composition for composing the insulating resin layer 2, or a resin composition having the values of properties within ±50% of those (coefficients of linear expansion) of the resin composition for composing the insulating resin layer 2. <P>COPYRIGHT: (C)2010,JPO&INPIT |
