发明名称 |
SURFACE MOUNTED PART, METHOD FOR MANUFACTURING THEREFOR, AND MOUNTING METHOD |
摘要 |
<P>PROBLEM TO BE SOLVED: To joint firmly a plurality of terminals of a surface mounted part and a plurality of pads of a mounting board through a conductive jointing material, and to suppress the spreading of conductive jointing material. Ž<P>SOLUTION: A surface mounted part 1 includes a body 2 having a terminal arrangement plane 2A and a plurality of terminals 3 arranged in the terminal arrangement plane 2A. Each of the plurality of terminals 3 includes a recessed portion 3A. When mounting the surface mounted part 1 on the mounting board having the plurality of pads using the conductive jointing material, a part of the conductive jointing material interposed between each terminal 3 and each pad intrudes into the recessed portion 3A of each terminal 3. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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申请公布号 |
JP2009246300(A) |
申请公布日期 |
2009.10.22 |
申请号 |
JP20080094118 |
申请日期 |
2008.03.31 |
申请人 |
TDK CORP |
发明人 |
TOMAKI SHIGEMITSU;TSUYA YOSHIKAZU |
分类号 |
H05K1/18;H01L23/12;H01L23/13;H05K3/32;H05K3/34 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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