| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate material in which a thick film can be produced through a simple production process and which hardly causes sinks during the mounting of chips, resulting in reduction of warpage. SOLUTION: In the substrate material, a metal foil 12, polyimide layer 11 and transparent resin layer 13 are laminated in this order. When the coefficient of the thermal expansion, thickness and module of the elasticity of the polyimide layer 11 are denoted by E<SB>1</SB>, T<SB>1</SB>and M<SB>1</SB>respectively, and the coefficient of the thermal expansion, thickness and module of the elasticity of the transparent resin layer 13 are denoted by E2, T2 and M2 respectively, the formula (1) is satisfied. COPYRIGHT: (C)2010,JPO&INPIT |
