发明名称 |
METHOD OF MANUFACTURING CONDUCTIVE PARTICULATE, CONDUCTIVE PARTICULATE, ANISOTROPIC CONDUCTIVE MATERIAL, AND CONDUCTIVE CONNECTION STRUCTURE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide: a method of manufacturing conductive particulates, which can efficiently manufacture conductive particulates with a CV value and an aspect ratio to be small and without generating contact failure by heating compression at the time of connecting circuits; conductive particulates made by using the manufacturing method of the conductive particulates; an anisotropic conductive material made of the conductive particulates; and a conductive connection structure. Ž<P>SOLUTION: The method of manufacturing the conductive particulates with a conductive metal layer formed on the surface of base material particulates includes a base material particulate manufacturing process which comprises: a step of adjusting polyamic acid mixed solution by mixing polyamic acid, metal alkoxide and non-polymerizable organic solvent; an emulsification step of mixing and agitating the polyamic acid mixed solution and emulsifier solution; and a heating step of heating the mixed solution after the emulsification process. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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申请公布号 |
JP2009245855(A) |
申请公布日期 |
2009.10.22 |
申请号 |
JP20080092999 |
申请日期 |
2008.03.31 |
申请人 |
SEKISUI CHEM CO LTD |
发明人 |
YAMADA YASUYUKI;ANADA MASAHIDE |
分类号 |
H01B13/00;H01B5/00;H01B5/16;H01R11/01;H01R43/00 |
主分类号 |
H01B13/00 |
代理机构 |
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代理人 |
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地址 |
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