发明名称 METHOD OF MANUFACTURING CONDUCTIVE PARTICULATE, CONDUCTIVE PARTICULATE, ANISOTROPIC CONDUCTIVE MATERIAL, AND CONDUCTIVE CONNECTION STRUCTURE
摘要 <P>PROBLEM TO BE SOLVED: To provide: a method of manufacturing conductive particulates, which can efficiently manufacture conductive particulates with a CV value and an aspect ratio to be small and without generating contact failure by heating compression at the time of connecting circuits; conductive particulates made by using the manufacturing method of the conductive particulates; an anisotropic conductive material made of the conductive particulates; and a conductive connection structure. Ž<P>SOLUTION: The method of manufacturing the conductive particulates with a conductive metal layer formed on the surface of base material particulates includes a base material particulate manufacturing process which comprises: a step of adjusting polyamic acid mixed solution by mixing polyamic acid, metal alkoxide and non-polymerizable organic solvent; an emulsification step of mixing and agitating the polyamic acid mixed solution and emulsifier solution; and a heating step of heating the mixed solution after the emulsification process. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2009245855(A) 申请公布日期 2009.10.22
申请号 JP20080092999 申请日期 2008.03.31
申请人 SEKISUI CHEM CO LTD 发明人 YAMADA YASUYUKI;ANADA MASAHIDE
分类号 H01B13/00;H01B5/00;H01B5/16;H01R11/01;H01R43/00 主分类号 H01B13/00
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