发明名称 MOUNTING BOARD AND SEMICONDUCTOR DEVICE USING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a means which allows respective back electrodes to be arranged in three or more lines, for example even when each distance between the back electrodes is set to about 0.5 mm by electronically connecting adjacent back electrodes with one another with plated wires in a step of electrolysis plating. <P>SOLUTION: In a backside of the mounting board 11, the efficiency of mounting an electric conductive pattern on a front side of the mounting board 11 is enhanced by locating a plated wire 18 which electrically connects the adjacent back electrodes 15, 15, and after plating is formed on electrode surfaces, the plating line 18 is divided. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2009246377(A) 申请公布日期 2009.10.22
申请号 JP20090145680 申请日期 2009.06.18
申请人 SANYO ELECTRIC CO LTD;KANTO SANYO SEMICONDUCTORS CO LTD 发明人 MITA KIYOSHI
分类号 H01L23/12;H01L23/32 主分类号 H01L23/12
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