发明名称 FIXING STRUCTURE AND METHOD FOR ELECTRONIC COMPONENTS
摘要 PROBLEM TO BE SOLVED: To provide a structure and method for fixing electronic components, which fixes an electronic component stably without any bonding agent and any excess time. SOLUTION: As a structure for stably fixing an electronic component (2) with lead wires (24) to a substrate (1), a bar-like or plate-like fastening member (3) is disposed so as to ride on the outer periphery of the electronic component (2). At least both end portions (3a, 3b) which ride on the electronic component (2) are constituted of a solderable metal so as to solder them to the inside of through-holes (13a, 13b) for the substrate fixing member (3) which are formed in the riding positions of the electronic component, by a solder (4) for filling the through-holes from the rear side of the substrate. The lead wires (24) are soldered to through-holes (14) provided on the substrate for the lead wires (24), by the solder (4) for filling the through-holes from the rear side of the substrate. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009246187(A) 申请公布日期 2009.10.22
申请号 JP20080092024 申请日期 2008.03.31
申请人 FDK CORP 发明人 FUKUI NORIO
分类号 H05K1/18;H05K3/34;H05K7/12 主分类号 H05K1/18
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