| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermoelectric module easily manufactured for integration and having a high quality and high reliability. Ž<P>SOLUTION: The thermoelectric module has: a plurality of semiconductor elements 4 having the same conductivity type and thermoelectric effect; high resistance layers 6 each integrally formed on a junction portion between adjacent semiconductor elements 4; and conductor layers 8 formed integrally in the inside of the high resistance layers 6 and electrically connecting a first 4a end to a second end 4b of the adjacent semiconductor layers 4. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
|
