| 摘要 |
<P>PROBLEM TO BE SOLVED: To achieve an electronic component-incorporating substrate which maintains symmetry of the substrate even in a state incorporating a passive component while eliminating warpage, and to provide an electronic component-incorporating substrate that achieves stabilized connection reliability by connecting a passive component using a material accompanied by alloy formation. <P>SOLUTION: An electronic component-incorporating substrate incorporating a passive component in a resin substrate having a plurality of layers of wiring wherein the passive component is arranged in an insulating layer at the central part of the plurality of layers in the electronic component-incorporating substrate, and the passive component is connected with the wiring layers using such a material as at least two kinds of metal material form an alloy for connecting the passive component electrically and mechanically. <P>COPYRIGHT: (C)2010,JPO&INPIT |
