| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent a polishing amount and a polishing rate of a pad or a wafer at an initial stage and a final stage of conditioning from drastically differing from each other by preventing clogging, securing sharp cutting performance of a cutting blade, restraining abrasion of the cutting blade to suppress change in single pressure of a blade edge, and stabilizing pad polishing performance. <P>SOLUTION: A plurality of projections 3 are provided on a conditioning face of a conditioner body oppositely contacting the polishing pad of a CMP device to project toward the conditioning face. A boundary line L is provided on a projection end face 4 of each projection 3 facing in a projecting direction so as to come across the projection end face 4. An inclined face 5 is formed to further project in the projecting direction as getting away from the boundary line L on one side of the boundary line L on the projecting end face 4. Thus, a ridge part of the inclined face 5 on a side in the projecting direction makes the cutting blade 7. A receiving face 6 is formed on the other side of the boundary line L to have an inclination relative to the projecting direction more gentle than that of the inclined face 5. <P>COPYRIGHT: (C)2010,JPO&INPIT |
