摘要 |
PURPOSE: A printed circuit board is provided to prevent the degradation of the electrical performance due to a bonding sheet by removing the bonding sheet around the signal transmission line. CONSTITUTION: A first dielectric layer(320) is laminated on a first ground layer(310). A signal transmission line(340) is formed on the first dielectric layer. A first bonding sheet(351) and a second bonding sheet(352) are laminated on the first dielectric layer. A second dielectric layer(370) is laminated on the signal transmission line, the first bonding sheet, and the second bonding sheet. A second ground layer(380) is laminated on the second dielectric layer. The first ground layer, the first dielectric layer, the signal transmission line, the first bonding sheet, and the second bonding sheet are extended to the same direction. The first and second bonding sheets bond the first dielectric layer and the second dielectric layer.
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