Method for preventing Kirkendall void formation for packages fabricated by joining an electronic component finished with electroplated Cu containing sulfur to solder and electronic packages fabricated by using the same,申请号KR20070120103-传众专利搜索

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发明名称	Method for preventing Kirkendall void formation for packages fabricated by joining an electronic component finished with electroplated Cu containing sulfur to solder and electronic packages fabricated by using the same
摘要
申请公布号	KR100922891(B1)	申请公布日期	2009.10.22
申请号	KR20070120103	申请日期	2007.11.23
申请人		发明人
分类号	H01L21/60;H01L23/48	主分类号	H01L21/60
代理机构		代理人
主权项
地址

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