| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique capable of decreasing a generation of splashing upon depositing by using an Al-Ni-La-Cu-based Al alloy sputtering target containing Ni, La, and Cu. SOLUTION: The Al-Ni-La-Cu-based Al alloy sputtering target contains Ni, La and Cu, in which (1) a total area of an Al-Ni intermetallic compound mainly comprising Al and Ni and having an average grain size of 0.3-3μm is 70% or more by area ratio based on an entire area of the Al-Ni intermetallic compound, and (2) a total area of an Al-La-Cu intermetallic compound mainly comprising Al, La and Cu and having an average grain size of 0.2-2μm is 70% or more by area ratio based on an entire area of the Al-La-Cu intermetallic compound, in a case where a portion of the sputtering target is observed within a range of from 1/4t (t: thickness) to 3/4t along a cross section vertical to a plane of the sputtering target by using a scanning electron microscope at a magnification of 2,000. COPYRIGHT: (C)2010,JPO&INPIT
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