| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce breakage, chipping and warpage of a wafer while keeping rigidity of the wafer, and restraining production cost thereof. Ž<P>SOLUTION: The backside of a wafer 1 with a surface structure of a device formed on the front surface is flatly polished. Next, a resist film is applied to the backside of the wafer 1, and a mask pattern is transferred thereto to form a grid-like resist pattern. Next, a grid-like rib 13 is formed on the backside of the wafer 1 by etching the backside of the wafer 1, and a step between the center part and an outer peripheral end of the wafer 1 is eliminated. Then, the grid-like rib 13 is formed on the backside corresponding to scrub lines on the front surface of the wafer 1. Next, the backside of the wafer 1 is stuck to a stage by an adhesive tape, and is cut along the scrub lines by a dicing blade. Next, cut chips 14 are peeled from the adhesive tape. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
|
