MULTILAYER WIRING BOARD AND ITS PRODUCTION PROCESS

摘要

PROBLEM TO BE SOLVED: To provide a multilayer wiring board which enhances adhesion strength of a via conductor and improves the product yield.

SOLUTION: A coreless wiring board 10 does not have a core substrate but includes a multilayer structure 20 obtained by laminating a conductor layer 26 and resin insulating layers 21-24 alternately. Each resin insulating layer 21-24 is formed to contain a glass cloth 36 in epoxy resin. A plurality of via holes 32 are made through each resin insulating layer 21-24, and a field via conductor 33 which connects the conductor layers 26 electrically is formed in each via hole 32. An end of the glass cloth 36 contained in each resin insulating layer 21-24 projects from the inner wall surface of the via hole 32 and bites into the sidewall of the field via conductor 33.

COPYRIGHT: (C)2010,JPO&INPIT