Tape for heat dissipating member, COF type semiconductor package having heat dissipating member and electronic apparatus thereof

摘要

PURPOSE: A heating member tape, a COF type semiconductor package equipping the heating member and an electronic device applying the same are provided to secure a heating path by fixing the heating member without separating the heating member and the contact member. CONSTITUTION: A COF(Chip On Film) semiconductor package includes an insulating substrate(13), a semiconductor device(11), an heat member(17), and a space. The insulating substrate has a flexibility characteristic. The semiconductor device is arranged to the upper side of the insulating substrate. The heat member is arranged to the lower surface on the insulating substrate. The space is formed between the lower surface and heat member of the insulating substrate.