| 摘要 |
<p>A wafer level semiconductor package is provided to improve the reliability for the solder joint of motherboard and solder ball. The wafer(10) level semiconductor package is comprised of a wafer, a polymer, a via hole(24), a filler(26) and a solder ball(20). The polymer is coated on the wafer upper side including the bond pad(12). The polymer has the coefficient of thermal expansion which is similar to that of the motherboard. The via hole is penetrated so that the electricity can be flowed to the bonding pad from the backside surface of wafer. The conductive filler is filled in the via hole. The solder ball is melted to connect with the conductive filler for electricity in the entrance of the via hole.</p> |
