Structure combining an IC integrated substrate and a carrier, and method of manufacturing such structure

摘要

The present invention provides a structure combining an IC integrated substrate (30) and a carrier (21), which comprises a carrier (21) and an IC integrated substrate (30) formed on the carrier. The interface between the IC integrated substrate and the carrier has a specific area (23) at which the interface adhesion is different from that at the remaining area of the interface. The present invention also provides a method of manufacturing the above structure and a method of manufacturing electronic devices using the above structure.