Manufacturing method of temperature measuring wafer, Temperature measuring wafer and Temperature measuring method of furnace for semiconductor processing,申请号KR20070131582-传众专利搜索

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发明名称	Manufacturing method of temperature measuring wafer, Temperature measuring wafer and Temperature measuring method of furnace for semiconductor processing
摘要
申请公布号	KR100922498(B1)	申请公布日期	2009.10.20
申请号	KR20070131582	申请日期	2007.12.14
申请人		发明人
分类号	H01L21/22;H01L21/205;H01L21/66	主分类号	H01L21/22
代理机构		代理人
主权项
地址

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