| 摘要 |
[PROBLEMS]To provide an apparatus and method for inspecting edges of semiconductor wafers, for easily inspecting the shapes of outer circumference edge sections of semiconductor wafers, by the same step or the same apparatus used for inspecting existence of a defect.[MEANS FOR SOLVING PROBLEMS]An apparatus for inspecting edges of semiconductor wafers is provided with a CCD camera (10) for outputting image signals by sequentially photographing outer circumference edge sections (101) of a semiconductor wafer (100) in the circumference direction; and an image processing unit (20) which processes the image signals sequentially outputted from the CCD camera (10). The image processing unit (20) is provided with an image information generating means (S2) for generating image information indicating the outer circumference edge section (101) of the semiconductor wafer (100) from the image signals; and a shape information generating means (S13) for generating edge shape information (Ap(Θ), Ub(Θ), Lb(Θ)) which indicates shapes of the outer circumference edge sections (101) at a plurality of positions (Θ), based on the image information. Inspection results are outputted based on the edge shape information.
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