| 摘要 |
The method of forming a floating gate array of a flash memory device includes: (a) forming a plurality of device isolations, which define active device regions, in a semiconductor substrate, the device isolations being formed such that upper portions thereof protrude from a surface of the substrate by a predetermined height; (b) forming tunnel oxide layers in the active device regions; (c) forming a floating gate-forming layer throughout an entire region of the substrate, including regions in which the plurality of device isolations and the active device regions are formed, the floating gate-forming layer being formed such that grooves are formed along the active device regions; (d) filling the grooves formed on the floating gate-forming layer with masking materials; and (e) patterning the floating gate-forming layer, using the masking materials filling the grooves as an etching mask.
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