METHOD FOR FABRICATING FLEXIBLE CIRCUIT BOARD AND THE BOARD, METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE AND THE PACKAGE

摘要

PURPOSE: A flexible circuit board and a method of manufacturing the same and a semiconductor package and a method of manufacturing the same are provided improve the reliability of a product by preventing an error due to damage of plating pattern. CONSTITUTION: A method of manufacturing a flexible printed circuit board is comprised of the steps: preparing a base film having a conductive pattern on it(S10); forming a plating resist on a test pad area of the conductive pattern(S20); forming the plating resist on the test pad and making it corresponding to the conductive pattern(S30); removing formed plating resist(S40); and forming an insulating member on an interior region and exterior region of the conductive pattern on which the plating pattern is formed(S50).