| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring forming method capable of forming a high-quality wiring pattern with high conductivity at a low cost for various kinds of substrates. <P>SOLUTION: The wiring forming method includes: patterning a silver halide emulsion onto at least one surface side of a substrate in accordance with a wiring pattern to form a patterned emulsion layer made of the silver halide emulsion on at least the one surface side of the substrate; exposing the patterned emulsion layer; and performing development processing for the exposed patterned emulsion layer to form a patterned conductive silver layer as the wiring pattern. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
