Assembly part manufacturing method for use during manufacturing of e.g. micro switch, involves positioning component at another component in carrier such that former component is fastened at latter component and is separated from carrier

摘要

The method involves providing two components (2, 3), and conveying the component (3) e.g. surface mounted device (SMD) component, to the component (2) in a carrier, which is formed as a lead frame. The component (3) is positioned at the component (2) in the carrier by connecting points (5, 6) in the carrier such that the component (3) is fastened at the component (2) and is separated from the carrier by laser radiations. An auxiliary element (4) of the carrier is fastened at the components by soldering, welding and bonding, where the auxiliary element is formed as spring arms (8). An independent claim is also included for an assembly part comprising an auxiliary element for fastening components.