| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate drying apparatus capable of shortening drying time. Ž<P>SOLUTION: In a substrate drying method, a control section 91 allows a supply nozzle 17 to supply a dry medium to a substrate W that has an adhered droplet of demineralized water, or the like and is placed in a treatment tank 9. The droplet of demineralized water, or the like adhered to the substrate W is removed by the physical force of the droplet of the dry medium. In this case, the substrate W is completely covered with the dry medium. The supply of the dry medium is stopped, the dry medium staying in the treatment tank 9 is discharged or collected, and then dry air is supplied to a supply nozzle 17 from a gas feeding pipe 77 to dry the dry medium adhering to the substrate W, thus dispensing with time required for replacing and decompressing gas in a chamber 1, and hence shortening the drying time of the substrate W. Also, no dry treatment is performed at a position where the substrate W is pulled up from the treatment tank 9, thus suppressing dimensions in the height direction of the device. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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