发明名称 |
Method and Apparatus for Inspecting Defects |
摘要 |
A two-dimensional sensor is installed inclining at a predetermined angle to a moving direction of a stage on which an object to be inspected is mounted and, in synchronism with the movement of the stage, a picked up image is rearranged so that there can be obtained an image in high-density sampling with a picture-element size or less of the two-dimensional sensor with respect to a wafer. Thus, interpolation calculation during position alignment becomes unnecessary, and size calculation and classification of a defect can be performed with high accuracy.
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申请公布号 |
US2009257647(A1) |
申请公布日期 |
2009.10.15 |
申请号 |
US20090420932 |
申请日期 |
2009.04.09 |
申请人 |
YOSHITAKE YASUHIRO;NAKANO HIROYUKI;SHIBATA YUKIHIRO |
发明人 |
YOSHITAKE YASUHIRO;NAKANO HIROYUKI;SHIBATA YUKIHIRO |
分类号 |
G06K9/00;G01N21/956;H01L21/66;H04N5/335 |
主分类号 |
G06K9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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