发明名称 |
Camera module, method of manufacturing the same, and electronic system having the same |
摘要 |
A camera module, a method of manufacturing the same, and an electronic system having the same are provided. The camera module includes an image sensor chip having an active plane and a backside, a ground wiring extending from a sidewall of the image sensor chip to the backside, a lens structure having a light detector with at least one lens stacked on the active plane, and a conductive housing extending to the ground wiring along with an outer wall of the lens structure excluding the light detector.
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申请公布号 |
US2009256931(A1) |
申请公布日期 |
2009.10.15 |
申请号 |
US20090381489 |
申请日期 |
2009.03.12 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE CHUNG-SUN;KWON YONG-HWAN;KANG UN-BYOUNG;LEE HYUEK-JAE;KWON WOON-SEONG;JANG HYUNG-SUN |
分类号 |
H04N5/76;H01L21/50;H04N5/225 |
主分类号 |
H04N5/76 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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