发明名称 Camera module, method of manufacturing the same, and electronic system having the same
摘要 A camera module, a method of manufacturing the same, and an electronic system having the same are provided. The camera module includes an image sensor chip having an active plane and a backside, a ground wiring extending from a sidewall of the image sensor chip to the backside, a lens structure having a light detector with at least one lens stacked on the active plane, and a conductive housing extending to the ground wiring along with an outer wall of the lens structure excluding the light detector.
申请公布号 US2009256931(A1) 申请公布日期 2009.10.15
申请号 US20090381489 申请日期 2009.03.12
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE CHUNG-SUN;KWON YONG-HWAN;KANG UN-BYOUNG;LEE HYUEK-JAE;KWON WOON-SEONG;JANG HYUNG-SUN
分类号 H04N5/76;H01L21/50;H04N5/225 主分类号 H04N5/76
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