发明名称 |
LEADFRAME FOR PACKAGED ELECTRONIC DEVICE WITH ENHANCED MOLD LOCKING CAPABILITY |
摘要 |
A packaged electronic device (20) includes a die pad (30), leads (32) arranged around the die pad (30), and a die (24) attached to an upper surface (34) of the die pad (30) and electrically connected to the leads (32). A packaging material (28) encapsulates the die pad (30), the die (24), and the leads (32). The die pad (30) includes indentations (42) formed in the upper surface (34) along a sidewall (38) of the die pad (30). The die pad (30) further includes indentations (44) formed in a lower surface (36) of the die pad (30) along the sidewall. The packaging material (28) fills the indentations (42, 44) thereby promoting adhesion between the die pad (30) and the packaging material (28) so that the die pad (30) and packaging material (28) cannot readily delaminate. |
申请公布号 |
WO2009126367(A1) |
申请公布日期 |
2009.10.15 |
申请号 |
WO2009US34073 |
申请日期 |
2009.02.13 |
申请人 |
FREESCALE SEMICONDUCTOR INC.;HOOPER, STEPHEN R.;MACDONALD, JAMES D.;SHUMWAY, RUSSELL S. |
发明人 |
HOOPER, STEPHEN R.;MACDONALD, JAMES D.;SHUMWAY, RUSSELL S. |
分类号 |
H01L23/495;H01L23/00 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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