METHOD AND APPARATUS FOR DEBONDING A SUBMOUNTED SUBSTRATE
摘要
<p>The present invention provides a debonding apparatus, a system comprising such apparatus, and methods for using such apparatus or system for the removal of flexible substrates (14) post-processing without damage to fabricated devices.</p>
申请公布号
WO2009126443(A1)
申请公布日期
2009.10.15
申请号
WO2009US38275
申请日期
2009.03.25
申请人
THE ARIZONA BOARD OF REGENTS, A BODY CORPORATE OFTHE STATE OF ARIZONA ACTING FOR AND ON BEHALF OF;BLANCHARD, ROBERT;REDNOUR, R., STEVE;LOY, DOUGLAS
