| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a jig for mounting an electronic component capable of preventing the curvature of a mounting substrate when mounting an electronic component on the mounting substrate or dismounting the electronic component from the mounting substrate. <P>SOLUTION: In mounting a BGA2 on a printed circuit board 3, a method includes: a step of interposing a BGA2 between a BGA holding jig 11 having a frame shape corresponding to the outline shape of the BGA2 and a substrate top jig 12 having a thickness corresponding to the gap between the lower surface of the BGA2 and the upper surface of the printed circuit board 3 and having the shape with one side among four sides of the frame shape open to fix it by a coupling pin 14; a step of threading the coupling pin 14 through a bolt hole 3b formed in the printed circuit board 3 and arranging the substrate bottom jig 13 having the roughly same shape as the BGA holding jig 11 on the backside of the printed circuit board 3 to fix it from the tip of the coupling pin 14 by using a coupling nut 15; and a step of heating the bump terminal 2a of the BGA2 and the land 3a of the printed circuit board 3 by a repairing device 1 to bond them. <P>COPYRIGHT: (C)2010,JPO&INPIT |
