| 摘要 |
PROBLEM TO BE SOLVED: To provide an injection moldable resin composition particularly suitable for a semiconductor sealing material, with respect to a resin composition excellent in solder crack resistance, adhesion, moisture resistance stability and continuous moldability to various components such as a lead frame. SOLUTION: The resin composition includes a thermosetting resin (A), an inorganic filler (B) and a release agent (C), wherein the release agent (C) is a modified polyolefin wax subjected to acid graft modification, and the release agent (C) is included in an amount of 0.03-1.00 pts.wt. based on 100 pts.wt., in total, of the thermosetting resin (A) and the inorganic filler (B). COPYRIGHT: (C)2010,JPO&INPIT |
