发明名称 LED LAMP DEVICE AND METHOD OF MANUFACTURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide an LED lamp device capable of eliminating a defect due to external force when mounted on an external connector and further miniaturizing, and in which a circuit section is composed of a printed circuit board, and to provide a method of manufacturing the same. <P>SOLUTION: In the LED lamp device mounted with an LED lamp on the printed circuit board, a case portion to which the printed circuit board is fit to support and a cover portion which is provided so as to integrally install the LED lamp, the printed circuit board, and the case portion, are included; the printed circuit board is provided with a connection terminal which is protruded from the cover portion and the case portion and is for connecting the external connector; the connection terminal is provided with a solder portion which is inserted and soldered to the printed circuit board and a branch portion which is bent on the reverse side to the solder portion; and the branch portion is sandwiched by a holding portion which is provided in the internal side of the cover portion to support. Accordingly, the defect due to external force when connecting the external connector is prevented. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009239255(A) 申请公布日期 2009.10.15
申请号 JP20080332188 申请日期 2008.12.26
申请人 TOYODA GOSEI CO LTD 发明人 ICHIKAWA TADAOKI;UMEDA YUKIHIKO
分类号 B60Q3/02;H01L33/48;H01R13/717 主分类号 B60Q3/02
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