| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame which suppresses the occurrence of cracks when bent and exhibits excellent adhesion to a mold resin. SOLUTION: The lead frame is obtained by forming a noble metal-plated layer 13 on the surface of a base stock metal 10 while interposing a plated substratum layer between them. The plated substratum layer is composed of a flat and smooth Ni-plated layer 11, which is formed on the base stock metal 10 by plating Ni by using a DC current or pulsed current having no polarity reversal component, and a surface-roughened Ni-plated layer 12 which is formed on the flat and smooth Ni-plated layer 11 by plating Ni by using a current containing a polarity reversal pulse. COPYRIGHT: (C)2010,JPO&INPIT |
