| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a via hole for use of a multilayer wiring structure capable of inhibiting connection failures among wires of the multilayer wiring structure and also fabricating by a simple process, as well as to provide a formation method of the multilayer wiring structure using the above method, and to provide the via hole for use of the multilayer wiring structure with reduced connection failures among the wires of the multilayer wiring structure. <P>SOLUTION: The formation method of the via hole for use of the multilayer wiring structure is characterized by that it includes a step of attaching aqueous or oil-based droplets to a part of a lower layer, and a step of applying either aqueous or oil-based interlayer insulation film forming coating liquid with a nature different from that of the droplets to an entire surface on the lower layer to form an interlayer insulation film on other than a region where the droplets are attached and forming the via hole in the region where the droplets are attached. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
