| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multilayer ceramics substrate that enhances reliability by preventing the occurrence of cracks, even if thermal stress is applied to a ceramic substrate according to the differences of thermal expansion coefficient among the mounted substrates, in heat cycle test and the like. Ž<P>SOLUTION: A ceramic substrate 11, which is formed by laminating and calcinating ceramic green sheets, includes: a circular recess 12 (12a and 12b) which has the shape of a concentric circle in the bottom of the ceramic substrate and has at least two or more stage differences; electrodes 13a and 13b provided in the bottom of each stage of the recesss 12a and 12b; a solder material 15 with which the recess is filled and which is bonded to the electrodes 13a and 13b; and a metal ball 16 which is bonded to the solder material. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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