NON-SUBSTRATE TYPE PACKAGE WITH EMBEDDED POWER LINE

摘要

The present invention relates to a non-substrate type IC packaging with embedded power line. The packaging comprises a base having a die attach section upon which a semiconductor die is accommodated. A plurality of contact pins are disposed on the base along at least a side of the die attach section. At least a power supply band is disposed on the base between the contact pins and the die attach section. Each of the at least a power supply band is connected to at least a contact pin and is shaped such that provision of a substrate for holding the same in place is obviated. Power supply connecting wires are connected at a first end to power supply contacts of the semiconductor die and at a second end to a respective location of the at least a power supply band. Connecting wires are connected at a first end to contacts other than power supply contacts of the semiconductor die and at a second end to a respective contact pin. An encapsulation accommodates the semiconductor die, the connecting wires and, a portion of each contact pin, and the at least a power supply band therein.