发明名称 LEAD FRAME AND PROCESS FOR PRODUCING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To produce a lead frame which has the uniform distance from an end of an inner lead to a rigid reinforcing part and in which the rigidity of the end of the inner lead does not fluctuate, by a simple process. <P>SOLUTION: A lead frame has a plurality of inner leads formed around a die pad, and a rigid reinforcing part provided which connects between inner leads adjoining to each other and between the adjoining inner leads and a support bar with a resin. Spaces between the inner leads adjoining to each other are parallel or become wider from a resin-coated area for forming the rigid reinforcing part toward a die-pad-side ends of the inner leads. Due to such constitution, when the resin is applied to the resin-coated area, the applied resin liquid does not spread toward the ends, whereby the distance between the rigid reinforcing part formed by curing the resin and the ends can be made even, and the ends of the inner leads have even rigidity. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009239089(A) 申请公布日期 2009.10.15
申请号 JP20080084298 申请日期 2008.03.27
申请人 SHIIMA ELECTRONICS INC 发明人 KUBOTA AKIHIRO;ISHIGAKI TOMOAKI;TAKAMATSU YOSHITO;KOJIMA NORIO
分类号 H01L23/50 主分类号 H01L23/50
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