发明名称 COOLING SYSTEM
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a cooling system that has a simple structure, does not grow in size, and can cool off two or more electronic devices. <P>SOLUTION: A cooling system 1 includes a casing 7, a main flow passage 15 prepared in the casing and in which a cooling wind flows, a heat radiating part 8 thermally connected to a heating element 2 and prepared in the main passage, and a fan 6 contained in the casing 7 and sending a cooling wind to the main flow passage. An outlet 20 is formed, which opens for a peripheral device 3, in a part where the cooling wind flows before it passes the heat radiating part 8 of the casing. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2009239212(A) 申请公布日期 2009.10.15
申请号 JP20080086755 申请日期 2008.03.28
申请人 DENSO CORP 发明人 MISUMI HARUKI;NIIMI YASUHIKO
分类号 H01L23/467;H05K7/20 主分类号 H01L23/467
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