| 摘要 |
PROBLEM TO BE SOLVED: To improve the bonding strength of a via conductor to a conductor pattern layer. SOLUTION: This manufacturing method of a substrate includes the following processes: (A) filling conductive paste into a via hole 11h of a base 11; (B) forming a recess in an end of conductive paste by applying pressure to a resin-made sheet stacked on the base 11 so as to cover the via hole 11h; (C) forming the via conductor 12 by curing the conductive paste; (D) forming an intervention layer 14 made of metallic material inside the recess of the via conductor 12; and (E) forming a conductor patterned layer 17 on the intervention layer 14 and on the surface of the base 11. COPYRIGHT: (C)2010,JPO&INPIT |
