BOARD FOR FABRICATING SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

摘要

PURPOSE: A substrate for manufacturing a semiconductor package and a manufacturing method thereof are provided to prevent a defect in a whole semiconductor package when a process for forming a subsequent semiconductor package is performed. CONSTITUTION: A substrate for manufacturing a semiconductor package is provided as a strip level substrate. The strip level substrate includes a plurality of unit level substrates divided by a scribe line(204). A window(W) is included in a central part of each unit level substrate. The window is integrally included about the unit level substrates arranged into one direction.