| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring board that has no core substrate and can be reduced in warping. <P>SOLUTION: The wiring board has a laminate BU formed by alternatively laminating two or more dielectric layers and two or more conductor layers upon another so that the first and second main surfaces MP1 and MP2 of the laminate BU may be formed of dielectric layers, a plurality of metallic terminal pads PD1 and PD2 formed on the first and second main surfaces MP1 and MP2, and a reinforcing frame ST which secures flatness by reinforcing the laminate BU. Semiconductor chips and the reinforcing frame ST are arranged on the first main surface MP1 and at least part of the metallic terminal pads PD1 and PD2 are electrically connected to internal conductor layers positioned in the laminate BU through via holes. At the same time, the metallic terminal pads PD1 and PD2 and semiconductor chips are flip-chip connected to each other through soldered connections and the coefficients of thermal expansion of all dielectric layers are adjusted to 15-40 ppm/°C and the coefficient of thermal expansion of the reinforcing frame ST is also adjusted to 15-40 ppm/°C. Since the difference between the coefficients of thermal expansion of the dielectric layers and reinforcing frame ST is small, the warping of the wiring board can be reduced. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
