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发明名称
PROCESSING THIN WAFERS
摘要
There is described a wafer processing system for thinned wafers that are easily broken during handling. The system protects against breakage during handling and provides for temperature controls during processing.
申请公布号
US2009252582(A1)
申请公布日期
2009.10.08
申请号
US20090485808
申请日期
2009.06.16
申请人
INTEVAC,INC.
发明人
BLUCK TERRY;SCOLLAY STUART;TONG EDRIC
分类号
H01L21/677
主分类号
H01L21/677
代理机构
代理人
主权项
地址
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