发明名称 |
Circuit Device and Method for Manufacturing the Circuit Device |
摘要 |
In a circuit device where a wiring layer, an insulating resin and a circuit element are stacked together in such a manner as to embed a bump structure into the insulating resin, the connection reliability between the bump structure and the circuit element is enhanced. A circuit device (10) has a structure where a wiring layer (20), an insulating resin layer (30) and a circuit element (40) are stacked in this order by a pressure bonding. The wiring layer (20) is provided with bump electrodes (22) in positions that correspond respectively to element electrodes of a circuit element (40). The insulating resin layer (30) is formed of a material that develops plastic flow when pressurized. The bump electrode (22) penetrates the insulating resin layer (30) and is electrically connected to a corresponding element electrode (42).
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申请公布号 |
US2009250251(A1) |
申请公布日期 |
2009.10.08 |
申请号 |
US20060085822 |
申请日期 |
2006.11.30 |
申请人 |
SHIBATA KIYOSHI;USUI RYOSUKE;INOUE YASUNORI |
发明人 |
SHIBATA KIYOSHI;USUI RYOSUKE;INOUE YASUNORI |
分类号 |
H05K1/02;H05K1/11;H05K3/32 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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