发明名称 SUBSTRATE PROCESSING APPARATUS AND METHOD FOR MANAGING SEMICONDUCTOR MANUFACTURING APPARATUS
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus capable of eliminating variation in quality of substrate process, irrespective of the time in the non-operational state of the apparatus during a predetermined manufacturing processing (lot processing or batch processing). <P>SOLUTION: The substrate processing apparatus has a control means for performing a first recipe to process the substrate; and performs a second recipe, to maintain a processing chamber for processing the substrate, when a predetermined period of time elapses, in a state in which the substrate is not fed for the sequential substrate process, after the first recipe is performed, to finalize the predetermined substrate processing. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2009231809(A) 申请公布日期 2009.10.08
申请号 JP20090006904 申请日期 2009.01.15
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 NOMURA MAKOTO;OZAKI YUKIO;NUNOSAWA REIZO;TAKAHATA SATORU
分类号 H01L21/02;H01L21/205;H01L21/31 主分类号 H01L21/02
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