发明名称 THERMOCOMPRESSION DEVICE, AND CONTROL METHOD OF THERMOCOMPRESSION DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a thermocompression device can ensure the joining reliability of a bonding material mainly containing a predetermined thermoplastic resin. Ž<P>SOLUTION: The thermocompression device 1 comprises: a roll device 30 for moving films coated with conductive particles R; a pressure-bonding tool 20 having an asperity surface; a reservoir 40 for storing conductive particles R; a first means for making the asperity surface of the pressure-bonding tool 20 face the reservoir 40 and for attaching conductive particles R to the asperity surface; and a second means for making the asperity surface of the pressure-bonding tool 20, in which conductive particles R are attached by the first means, face the film 34 and for applying pressure on the asperity surface. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2009231707(A) 申请公布日期 2009.10.08
申请号 JP20080077777 申请日期 2008.03.25
申请人 TOSHIBA CORP 发明人 HIRAMOTO SHUJI
分类号 H01L21/60;H05K3/32;H05K3/36 主分类号 H01L21/60
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