| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a circuit connection material which can reduce and stabilize a connection resistance between facing circuit electrodes and can improve insulation sufficiently between neighboring electrodes as well, and provide a film type circuit connection material using the above and a connection structure of a circuit member and a manufacturing method of the same. Ž<P>SOLUTION: The connection structure 10 of a circuit member is provided with circuit members 20, 30 in which circuit electrodes 22, 32 are formed. A circuit connection member 60 for connecting the circuit members 20, 30 with each other so that the circuit electrodes can face with each other is composed of a hardened body made of a circuit connection material. The circuit connection material contains an adhesive agent composition and coated particles 50 in which a part of a surface 51a of a conductive particle 51 is coated by insulative particulates 52, and a mass of the insulative particulate 52 is 2/1000-26/1000 of a mass of the conductive particle 51, and the circuit electrode 22 or the circuit electrode 32 has a bump having an area of less than 3000 μm<SP>2</SP>. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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