Pre-Treatment Method for Plating and Instrument for Waterworks of Lead-Contained Copper Alloy

摘要

A pre-treatment method for plating wherein lead or the like dissolved in an etching liquid is not electro-deposited (re-adhesion) on a lead-contained copper alloy to be plated even without adding a chelating agent forming an insoluble inert combined substance. The lead-contained copper alloy to be plated is dipped in an alkaline etching liquid without adding a chelating agent which would form an insoluble inert combined substance. In this state, electrolysis where the lead-contained copper alloy functions as one of a positive electrode and a negative electrode, and electrolysis where the lead-contained copper alloy functions as the other of the positive electrode and the negative electrode are performed alternately (PR electrolysis).