| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition which has excellent photosensitive characteristic, can be developed with an aqueous alkali solution, ensures sufficiently small shrinkage upon curing, and forms a resist pattern having excellent adhesion and thermal shock resistance. <P>SOLUTION: The positive photosensitive resin composition comprises (A) a polybasic acid anhydride-modified phenolic resin obtained by reacting phenolic hydroxyl groups of a phenolic resin with a polybasic acid anhydride, (B) a compound which generates an acid under light, (C) a heat crosslinking agent and (D) a solvent. <P>COPYRIGHT: (C)2010,JPO&INPIT |
