| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition that can be micro-processed since it has photosensitivity, is developable with a diluted alkali aqueous solution and curable at a low temperature (200°C or lower), has high flexibility, excellent electric insulation reliability, solder heat resistance and organic solvent resistance, has little warpage of a substrate after being cured and excellent adhesiveness with a sealing agent. <P>SOLUTION: The photosensitive resin composition contains: at least (A) a polyimide resin having an imide skeleton, a polycarbonate skeleton and a urethane bond in the main chain and a developable group and a photosensitive group in a side chain; (B) a photosensitive compound having at least one photosensitive group in the molecule, excluding a polyimide resin having an imide skeleton, a polycarbonate skeleton and an urethane bond in the main chain and a developable group and a photosensitive group in a side chain; (C) a photopolymerization initiator, and (D) a thermosetting compound. <P>COPYRIGHT: (C)2010,JPO&INPIT |
